Capability_Shenzhen Sendwin Electronic Co.,LTD

No	Manufacturing Parameter	Normal	Limited
01	Min. line width/space	3mil	2mil
02	Min. line width/space	3mil	2mil
03	Min. Hole	0.2mm	0.15mm
04	Hole cooper Thickness	0.6-2.8mil	0.6-2.8mil
05	PTH Hole Diameter Tol	±3mil	±3mil
06	NPTH Hole Diameter Tol	±2mil	±2mil
07	Registration Tolerance	±2mil	±2mil
08	Outline Tolerance	±5mil	±4mil
09	Max. panel size	720x622mm	720x622mm
10	Board Thickness	0.4-3.2mm	0.3-4.0mm
11	PCB layers Max	18	20
12	Min SM Dam	4mil	4mil
13	Aspect ratio	8:1	9:1
14	Thermal shock test	288℃（10s3times）	288℃（10s3times）
15	Bow & twist	≦0.75%	≦0.65%
16	Electrical Strength	>1.3KV/mm	>1.3KV/mm
17	Peel Strength	1.4N/mm	1.4N/mm
18	Solder mask Hardness	≧6H	≧6H
19	Flammability rating (Highest level)	94V-0	94V-0
20	Impedance Control Tol	±8%	±8%
21	V-Scoring Offset Tol	+/-0.1mm	+/-0.1mm
22	HDI Stack-up	1+N+1	4+N+4
23	Min PP thickness（um)	75	35
24	Min thickness（um)	600	550
25	Min. line width/space（um)	60/60	50/50
26	Min copper thickness（um)	25	18
27	Blind Via Hole（um)	75-150	75-150
28	SM Dam（Black）（um)	100	80
29	SM Dam（Green）（um)	75	65
30	BAG pitch（um)	400	250
Surface treatment	OSP、ENIG、HASL、Gold Finger、Slective plating such as HAL+Gold Finger, ENIG+Hard Gold etc